What are the differences between conductive adhesive and ordinary adhesive production and processing?

Conductive adhesive is currently most of the electronic conductive products more of a class, the main function is used for thermal conductivity sensing, suitable for precision lead assembly, low temperature connection, especially for the interconnection of thermal components, and also has good flexibility and fatigue resistance, widely used in adhesives. However, it is in the products of silicone rubber and conductive silicone are currently more commonly used rubber varieties, in the production process of silicone products manufacturers, they have different production differences, the specific differences are as follows:

Conductive silicone products:

Conductive adhesives are used in a wide range of electronic assembly sensing, including thin wires and printed materials, electroplated substrates, metal layers of ceramic adhesives, metal chassis bonding, bonding wires to tube seats, bonding elements to flat faces across printed lines, bonding waveguide tuning and hole repair, etc., all of these functions are due to its material blending properties, including silver or copper, nickel, nickel, and copper. Toner and other fillers achieve conductivity, among which bonding strength additives and rheological accelerators are their main additive materials, so it also creates the advantages and defects of conductive silica gel.

Ordinary silica gel and conductive silica gel production still has a certain difference in performance, in the processing of silicone products, ordinary rubber efficiency is fast, low defective rate, the performance of the output is different, ordinary rubber tensile toughness is normal than conductive rubber, and conductive rubber in addition to the electrical performance is prominent, in toughness and material life will be affected by a certain degree, in corrosion resistance, high and low temperature resistance. The wear resistance and the aging property of electrical insulation have decreased.