Classification and application of thermal conductive silica gel

Thermally conductive silicone is mainly used in applications that require heat dissipation, such as computer chips.Its function is to conduct heat and heat dissipation for heating parts. The performance of ordinary heat-conducting silica gel depends on the composition of aluminum hydroxide mixed with it, while the special heat-conducting silicone grease will be mixed with an appropriate amount of precious metal oxide.It is mainly composed of polydimethylsiloxane, aluminum hydroxide, quartz powder, methyl trimethoxysilane, chelated titanium four components.

Thermally conductive silica gel can be divided into sebum, paste and patch three states according to the different use occasions.

Thermal conductive silicone

Thermal conductive silicone grease is one of the highest thermal conductivity of the three kinds of thermal silicone, thermal conductive silicone grease is a paste, viscous, non-drying, under normal circumstances, can be used for more than five years.Thermal conductive silicon grease is mainly used to fill the gap between the CPU and the heat sink, which is also called thermal interface material.Its function is to conduct the heat emitted by the CPU to the heat sink, so that the CPU temperature can be kept at a stable working level, to prevent the DAMAGE of THE CPU due to poor heat dissipation, and extend the service life.Because in the application of heat sink and heat conduction device, even two planes with very smooth surface will have a gap when they contact each other. The air in these gaps is a bad medium of heat conduction, which will hinder the heat conduction to the heat sink.The thermal conductive silicone grease is a kind of material that can fill these gaps, making the heat conduction smoother and faster.

Thermal conductive paste

Thermal conductive paste belongs to the thermal interface materials, thermal conductivity silica gel is the RTV glue of thermal conductivity, a gel can be cured at room temperature, the color is white or black, after reaction with water vapor in the air is needed to cure, biggest different thermal conductive paste and thermal conductive silicone is thermal paste can cure, after curing degree of elasticity, extensibility, and bonding thermal conductive paste has a fixed and adhesive performance, so in line with the general craft seal.The thermal conductivity of thermal-conductive paste is the lowest of the three kinds of silica gel. It is suitable for the thermal conductivity of capacitor resistances and other components, as well as the bonding between some heating components. It has strong acid and alkaline resistance, but the working temperature of thermal-conductive paste is generally not more than 200℃.

Heat-conducting patch

In industry, thermal conduction patch is needed for heat dissipation of large area such as power supply. Because of its low cost, non-drying property and easy replacement, thermal conductivity is generally low, with high temperature up to 300 ° C and low temperature generally -60 ° C.In electronic products, commonly used in certain calorific value is small, the but again not easy heat dissipation of electronic components and the chip's surface, suitable for ordinary devices simple and easy processing, on the edge of the good battery, usually with a patch of thermal conductivity, the thermal conductivity of at the same time, you can fill the gaps between the battery and the shell, and act as a buffer, stable effect.This material has a low thermal conductivity, so it is not suitable for high-end electronic products (such as computer Cpus).